Degradation behavior of heat-treatment silicate adhesive under special working conditions

Abstract Inorganic adhesive is widely used in the sealing and connection of electronic devices. Its insulation highly important performance installation. In this paper, resistance tensile strength different composite silicate samples were measured by test machines. The morphology surface composition analyzed microscope energy spectrum analyzer. results show that: a humid environment, increases with rising heat treatment temperature, decreases increment wet environment. When modulus ratio colloidal liquid range 7.2~9.1 heat-treatment temperature larger than 600°C, effect moisture resistant remarkable. deteriorates increasing humidity. Furthermore, ascending rises when less 7.2, declines it more 9.1.